AirJet Mini, the world’s most advanced solid-state active cooling chip, will be appearing in Lenovo products following collaboration with Lenovo’s Innovation Accelerator
Frore Systems, today announced their collaboration with Lenovo’s Innovation Accelerator to explore collaborating on future innovative products and solutions.”. Frore Systems is excited to be collaborating with Lenovo, contributing to their bold vision to deliver Smarter Technology for All. Lenovo, the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services, invests in world-changing innovation to build a more equitable, trustworthy, and smarter future for everyone, everywhere.
AirJet is a great example of the way our Innovation Accelerator identifies new and valuable technologies that support our bold vision to deliver Smarter Technology for All.” said Vico Song, General Manager of Lenovo’s Innovation Accelerator. “We are excited to be working with Frore Systems to enhance AI performance and build a smarter future.”
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“We are honored to be collaborating with Lenovo’s Innovation Accelerator,” said Seshu Madhavapeddy, CEO and Founder of Frore Systems. “AirJet® Mini removes thermal barriers, that have traditionally limited ultra-compact systems, allowing consumer products like super slim notebooks, tablets, and wearables to think longer, run faster, and operate in silence. We are excited to bring the many advantages of AirJet solid-state active cooling to some of Lenovo’s premium products, unlocking the new AI Thermal Stack that will enable the next generation of ultra-compact Edge AI devices.”
AirJet Mini continues to receive industry recognition in 2026 including at COMPUTEX with a Best Choice Award, and at CES with its third consecutive Innovation Award, underscoring continued industry recognition for solid-state active cooling technologies that remove thermal limits from next-generation AI systems. These honors recognize AirJet Mini’s outstanding functionality, innovation, and market potential. Frore Systems’ most powerful chip to-date, AirJet Mini G2 replaces conventional fans and heatsinks with a compact chip that removes 7.5W of heat.
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AirJet® – Built for the Rise of AI Reasoning Models
As Edge AI evolves from simple inference toward AI reasoning models and Agentic services, workloads are becoming sustained and compute intensive. These models spend more time “thinking” and “orchestrating,” placing significantly greater thermal demands on edge devices.
AirJet®Mini G2 is designed specifically to support this shift – enabling processors to sustain higher performance levels without throttling. This advance aligns with Frore’s Law, the company’s long-term vision to double thermal performance every two years – keeping pace with AI compute demand.
AirJet®Mini G2 Technical Highlights
- Heat dissipation: 7.5 W (50% increase over AirJet Mini G1)
- Dimensions: just 27mm × 41.5mm × 2.65 mm, supporting ultra-compact form factors
- Back pressure: 1,750 Pa (~10x higher than a fan), enabling dustproof and water-resistant devices
- Noise level: 21 dBA, enabling silent operation
- Design: solid-state, with no moving mechanical parts, delivering long life
AirJet®Mini G2 generates high-velocity pulsating air jets that efficiently eject heat from compact enclosures, enabling sleek, light, ultra-compact, silent, vibration-free, dustproof, and water-resistant device designs. AirJet enhances performance across numerous devices from notebooks, tablets, Mini-PCs, smartphones, 5G WiFi Hotspots, cameras and SSDs, to the tsunami of consumer and industrial IOT devices.
