Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam is now moving to fulfill demand for its E-Beam Lithography (EBL) production systems from semiconductor leaders in Taiwan.
Taiwan is a leader in producing semiconductors that are fueling the exponential growth of era-defining technologies like agentic AI and quantum computing. In the fabrication process, high-productivity maskless EBL is demonstrating unique advantages over both mask-based optical lithography and single-source direct-write lithography, specifically in advanced packaging, where imperatives like high-speed, low power chip-to-chip communications are paramount. In delivering unique capabilities to address these imperatives, Multibeam is redefining the future of advanced semiconductor packaging, giving chip makers the tools to rapidly create custom solutions and bring breakthrough products to market faster than ever before.
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Quantum computing is a natural candidate for EBL as the effort to scale this advanced technology drives interest in utilizing a conventional CMOS process flow to volume produce silicon-based qubits. Multibeam’s multiple-column EBL solution is an excellent drop-in fit for this application with its ultra-high resolution and powerful productivity advantages.
Since breaching the throughput barriers that had previously limited the adoption of EBL, Multibeam’s technology has become a high-value enabler of rapid prototyping and 2.5D/3DIC packaging. Here, the technology promises transformative improvements in die-shift, reticle stitching, 3D chip-stacking, and glass substrate patterning, thereby enabling next-generation advanced integration with significant power reductions. In addition, silicon photonics, optical gratings, MEMs and sensors packaging and system-in-package applications benefit significantly from the high-performance system.
Multibeam President Ken MacWilliams called Taiwan a key market for Multibeam, adding: “Partnering with MIC will help us engage with local manufacturing leaders in Taiwan and contribute new lithographic capabilities to their fabs. Since introducing our first production system, customer interest has accelerated. Now, with a next-generation system on our near-term roadmap, manufacturers will have an even more powerful lithography technology to enable emerging and existing applications. We are pleased to leverage MIC’s expertise and vast network, and we look forward to growing our business in the region.”
MIC’s Senior Department Manager, Sky Li added: “At our home base in Taiwan’s manufacturing hub, we have a clear view of the soaring complexity of IC making, as well as the process technologies required to keep pace with the innovations. Multibeam operates at the cutting edge with a flexible maskless lithography solution re-imagined for the technical and economic imperatives of the new era. Their unique EBL technology, pioneered by world-class lithography, patterning, and product experts, will be immensely enabling for Taiwanese customers. We can’t wait to get started.”
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